High pressure filterCombining etching processing and diffusion bonding, enables manufacture of Products which were difficult to process until now.
For materials, stainless steel, iron, copper, etc.
A large number of holes made in a 0.05 mm SUS foil by etching processing, and 30 sheets stacked and integrated (thickness 1.5 mm) by diffusion bonding.
Etching + diffusion bonding
Beyond the hole can be seen
Middle part enlarged photo
New heat sink material
melted and impregnated aluminum into the pores of carbon.
It is lightweight, has low thermal expansion and high thermal conductivity characteristics, and is compatible with nickel plating, gold plating, etc. It is a material excellent in machinability.
AlC-150 is a Carbon with Aluminum impregnated material