We manufacture and develop heat sink materials based on carbon of light weight, low thermal expansion and high thermal conductivity.
Main applications are mobile phone base station, PKG (4G / 5G communication device) for GAN element, Semiconductor radar element, Heat sink for vertical LED etc.
Our proprietary “S-CMC® (super CMC)” is composed of multilayered flat plates of Mo foil and Cu foil. It is a low thermal expansion cladding material superior in thermal conductivity and low thermal expansion to Mo powder product.
By using Mo foil, the amount of Mo can be reduced to 1/5 to 1/10, and the thermal expansion of S – CMC can be reduced to 6 to 10 ppm / ° C. At that time, the thermal conductivity reaches 330 to 360 W / mK, which is 1.5 times of conventional products.
In addition, the new method “high-temperature low-pressure press diffusion bonding” overcomes “occurrence of waviness”, “nonuniformity in thickness”, “no flatness” which was a drawback of conventional method “rolling” and enabled “High thermal conductivity” and “Low cost”.
It can be applied to various semiconductor fields, and particularly suitable as a heat sink for GAN elements used for 4G / 5G communication.
※Patent acquisition: patent number 3862737
※ Trademark registered
- Heat sink of GAN element for 4G / 5G communication
- Heat dissipating board of metal package
- Ceramic package heat sink
- Heat radiation board of optical communication device
- Press punching
- Milling etc.
Physical properties table
Comparison of thermal conductivity
Sectional view of S-CMC
（Cu/Mo/Cu/Mo/Cu 5 Ply）
Awarded Special Prize of Monozukuri Japan Award (2015)
Monozukuri Japan Award Winner Introduction Booklet (P56-57)
Other heat radiation materials
We manufacture various heat radiation materials such as carbon sheet (for PC), carbon / aluminum composite material, SiC / aluminum composite material, etc.
We can make from one prototype. Please feel free to consult us.